The semiconductor bonding market in North America is expected to grow from US$ 134.90 million in 2022 to US$ 204.23 million by 2028. It is estimated to grow at a CAGR of 7.2% from 2022 to 2028.
Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions is Driving the Growth of the Market
The growing demand for semiconductor bonders has compelled the market players to increase investments in the development of new and innovative product offerings. A few of the major product developments and launches are mentioned below:
In September 2021, Palomar Technologies announced the launch of its new Palomar 3880-II Die Bonder. The upgraded version provides maximum productivity and reduces programming time up to 95%. In September 2020, Palomar Technologies launched a new Palomar 8100 Wire Bonder. It is a fully automated, thermosonic high-speed ball-and-stitch wire bonder. It is capable of ball bumping and customized looping profiles. In addition, the demand for bonding solutions is rising for various applications. Hence, the companies are participating in partnerships and collaborations with other companies to cater the customer needs. A few such partnerships and collaborations by the companies are mentioned below:
In September 2021, SUSS MicroTec SE announced its partnership with SET Corporation SA. Under this partnership, the companies will provide a fully automated, customizable, and highest-yield equipment solution to its customers. In October 2020, Applied Materials, Inc. announced that they are collaborating with BE Semiconductor Industries N.V. to develop solutions for die-based hybrid bonding. It is an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications such as high-performance computing, AI, and 5G. In May 2019, Xperi Corporation announced a new IC package bonding technology for semiconductor devices. DBI Ultra, a new semiconductor wafer bonding technology is used for in the production of smartphone image sensors. In addition, it is also used for various applications, including IoT devices, mobile devices, and others in industrial, automotive, and medical industries. Thus, the growing number of product launches, partnerships, and collaborations related to semiconductor bonding solutions is driving the growth of the North America semiconductor bonding market.
Market Overview
The US, Canada, and Mexico are the key contributors to the semiconductor bonding market in the North America. North America has a huge demand for 3D semiconductor assembly and packaging solutions. An increasing number of companies, majorly in the automotive sector, are adopting advanced technologies such as IoT and artificial intelligence. Robert Bosch GmbH; Allegro MicroSystems, Inc.; Texas Instruments Incorporated; Qualcomm Technologies, Inc.; InvenSense; and Honeywell International Inc. are a few of the prominent companies operating in the North America semiconductor bonding market. The rise in the demand for MEMS and sensors in the region has provided opportunities for market leaders engaged in the manufacturing of die bonders, wafer bonders, and flip-chip bonders. The rising demand for vehicle and electronic devices is rising the demand for MEMS sensors which in turn will rise the demand for semiconductor bonding market. The companies operating in the market are also focusing on adopting digital technologies, including augmented reality (AR), virtual reality (VR), and the Internet of Things, which are contributing to the rising demand for MEMS and sensors in the region. For instance, in August 2022, MRSI Systems (Mycronic Group), a manufacturer of fully automated, high-speed die bonding, high-precision, and epoxy dispensing systems, was acknowledged as a 2022 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category. Further, several players are focusing on projects that require the installation of semiconductor bonding equipment. For instance, in February 2021, Palomar Technologies, announced that Bay Photonics is working on projects that need the placement and bonding of flip-chip photonics devices, which require the usage of specialized equipment, such as Palomar 3880 Die Bonder. Such initiatives are projected to boost the demand for semiconductor bonding equipment in the coming years.
North America Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
North America Semiconductor Bonding Market Segmentation
The North America semiconductor bonding market is segmented into type, technology, and country.
Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.
Based on country, the market is segmented into the US, Canada, and Mexico. The US dominated the market share in 2022.
ASMPT; DIAS Automation (HK) Ltd.; EV Group; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the North America region.
At 7.2% CAGR, the North America Semiconductor Bonding Market is speculated to be worth US$ 204.23 million by 2028, says The Insight Partners
According to the Insight Partners’ research, the North America semiconductor bonding market was valued at US$ 134.90 million in 2022 and is expected to reach US$ 204.23 million by 2028, registering a CAGR 7.2% from 2022 to 2028. Rising adoption of stacked die technology in IoT devices and growing number of product launches, partnerships, and collaborations related to semiconductor bonding solutions is driving the growth of the market are the critical factors attributed to the market expansion.
Due to the OEM’s increased need for enhanced capabilities and performance in smaller printed circuit boards (PCBs), the adoption of stacked die technology has grown in various electronic applications such as IoT and mobile devices. Stacked die refers to the placement of one chip on top of another or a spacer instead of the chip, followed by another chip. Sets of many rows of wire bonding loops are arranged, with each set connecting to a different die or spacer. Hence, remaining space after stacked die is used to fit many functionalities into a small die placement area. Thus, using stacked die technology to place the circuitry helps preserve valuable PCB space. Due to the limited workspace that PCB assembly and manufacturing companies witnessed with such extremely rigid and rigid-flex circuits, the demand for stacked die technology in IoT device is increasing. Moreover, the usage of stacked die significantly enhances design processes of semiconductor. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live tracking IoT gadget cannot be huge either. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market. In addition, OEMs in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In Internet of Things (IoT) devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates which will lead to the growth of the North America semiconductor bonding market.
On the contrary, fluctuation in the price of semiconductor components hurdles the growth of North America semiconductor bonding market.
Based on type, the North America semiconductor bonding market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held 41.3% market share in 2022, amassing US$ 55.71 million. It is projected to garner US$ 83.70 million by 2028 to expand at 7.0% CAGR during 2022–2028.
Based on application, the North America semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held 33.8% market share in 2022, amassing US$ 45.58 million. It is projected to garner US$ 74.53 million by 2028 to expand at 8.5% CAGR during 2022–2028.
Based on country, the North America semiconductor bonding market has been categorized into the US, Canada, and Mexico. Our regional analysis states that the US captured 71.8% market share in 2022. It was assessed at US$ 96.81 million in 2022 and is likely to hit US$ 145.21 million by 2028, exhibiting a CAGR of 7.0% during the forecast period.
Key players profiles in the North America semiconductor bonding market report are ASMPT; DIAS Automation (HK) Ltd.; EV Group; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; Yamaha Motor Corporation, among others.
Sep-2021, Palomar Technologies launched new Palomar 3880-II Die Bonder. In April 2022, Smith+Nephew announced new enabling technologies for its INTELLIO Connected Tower Solution with the introduction of the DOUBLEFLO Inflow/Outflow Pump* and 4KO (Optimized) Arthroscopes. Sep-2020, Palomar Technologies announced the launch of new Palomar 8100 Wire Bonder.
